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Influence of Mn on wettability and microstructure of low-silver lead-free solders

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DOI zdlpnp3z4l/1592216

作者张群超;张富文;赵朝辉;张品;胡强

机构地区不详

出处《中国焊接：英文版》 2015年3期

关键词低银钎料无铅钎料锰掺杂润湿性微观

分类 [金属学及工艺][焊接]

出版日期 2015年03月13日（中国期刊网平台首次上网日期，不代表论文的发表时间）

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来源期刊

中国焊接：英文版

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低银钎料无铅钎料锰掺杂润湿性微观

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