Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator-中国期刊网

摘要在这份报纸，我们在场一三维(3D)在为收音机频率的晶片水平的真空包装技术微机电的系统(RFMEMS)共鸣器，低损失的硅vias在被用来播送RF发信号。Au-Sn焊接结合被采用象电的导体一样提供真空封装。封装帽子的一个RF模型被建立评估包装的寄生效果，它提供3DRFMEMS封装的一个有效设计答案。与建议包装结构，24dB的signal-to-background比率(SBR)被完成，以及共鸣器的优秀因素(Q因素)在包装以后从8000～10400增加。包装共鸣器有线性频率温度(英尺)在在0楨?慰数?之间的一个温度范围特征?牵敶?牡?牰癯摩吗？？

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Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

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Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

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