简介:AdhesionimprovementofCVDdiamondfilimbyintroducinganelectro-depositedinterlayer;Agitation:themostversatiledegreeoffreedomforsurfacefinishers;Developmentofhydroxyapatitecoatingonporoustitaniumviaelectro-depositiontechnique;EffectofintensemagneticfieldonCdTeelectro-deposition;ElectrodepositionofMetallicLithiumonaTungstenElectrodein1-Butyl-l-methylpyrrolidiniumBis(tritluoromethanesulfone)imideRoom-temperatureMoltenSalt
简介:[篇名]Electro-depositionoftantalumontumgstenandnickelinLiF-NaF-CaF{sub}2meltcontainingK{sub}2TaF{sub}7electrochemicalstudy,[篇名]Electro-EpitaxialBufferLaycrsforREBCOTspeArchitectures,[篇名]EQCMwithair-gapexcitationelectrode.Calibrationtestswithcopperandoxygencoatings,[篇名]FormationofWell-definedNanocolumnsbyIonTrackingLithography,[篇名]Fundamentalexperimentalstudyonfreefabricationofnanocrystallinecopperbulkbyselectiveelectrodepositionwithelectrolytejet,[篇名]Magneticnanowirearraysobtainedbyelectro-depositioninorderedaluminatemplates,[篇名]Morphologicalcharacteristicsofnickelparticleselectrodepositedfromchloridedominantsolution.