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简介：Crackopeningdisplacement(COD)wasappliedtocharacterizethefractureinitiationofthetoughhighdensitypolyethylene.Normalsinglesidenotchedthree-pointbendspecimensandsilicarubberreplicatechniqueswereusedtostudythecharacteristicCODofhigh-densitypolyethylenepipeanditsbutt-fusionjointsincludingtheweldfusionzoneandheataffectedzoneatdifferenttemperaturefrom-78℃to20℃.TestingresultsshowthatthecharacteristicCODappearstodependonthestructuralfeaturesthataredeterminedbyweldingprocessandthetestingtemperature.Asthetemperatureislowered,thecharacteristicCODofallzonesstudieddecreases.Becausetheweldingprocesssignificantlychangessomestructuralfeatureofthematerial,characteristicCODoftheweldfusionzoneisthesmallestoneamongthoseofthethreezones.TheresultscanbeusedfortheengineeringdesignandfailureanalysisofHDPEpipe.

简介：ＥｆｆｅｃｔｓｏｆｓｔｒｅｎｇｔｈｍａｔｃｈｉｎｇａｎｄｃｒａｃｋｄｅｐｔｈｏｎｔｈｅｆｒａｃｔｕｒｅｐａｒａｍｅｔｅｒｓｆｏｒｗｅｌｄｅｄｊｏｉｎｔｓＴａｎｇＷｅｉａｎｄＳｈｉＹａｏｗｕ（Ｘｉ＇ａｎＪｉａｏｔｏｎｇＵｎｉｖｅｒｓｉｔｙ）Ａｂｓｔｒａ...

简介：Inthisinvestigation,themechanicalpropertiesandlow-temperaturefracturetoughnessofAPI5LX65offshorepipelineweldedjointswerestudied.StructureIntegrityAssessmentProcedure(SINTAP)-FailureAssessmentDiagram(FAD)methodwasappliedtothepipestructurewithsurfaceflawattheweldtoe.AccordingtotheISOstandardBS7448,theCTODfracturetoughnessoftheweldedjointswasdeterminedatthetemperatureof0℃.Fortheheat-affectedzone(HAZ)specimens,post-testmetallographicanalysiswasperformedtoverifythatthetipofthecrackwaslocatedinthecoarsecrystalzoneinordertoconfirmthevalidityoftheaboveresults.Thefailurelinesofanalysislevel1and3ofweldmetalwerederivedfromtheresultsofthemechanicalpropertytest.Theassessmentwasperformed,consideringthemaximumlaystress,residualstressconservativelyassumedtobeuniformtensilestress,andminimumCTODvalue.Theresultsoftheassessmentshowedthatpipelinestructurewithasurfaceflaw(theheightandlengtharerespectively2.2mmand5mm)attheweldtoeissafe.ThisstudylaysthefoundationofapplicationofSINTAPtopipelinestructureassessment.

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简介：TheCu/Sn-3.OAg-0.5Cu/Cubuttingsolderjointswerefabricatedtoinvestigatetheevolutionoftheinterfacialintermetalliccompound(IMC)andthedegradationofthetensilestrengthofsolderjointsundertheeffectofelectromigration(EM)andagingprocesses.Scanningelectronmicroscopy(SEM)resultsindicatedthattheCu_6Sn_5interfacialIMCpresentedobviousasymmetricalgrowthwiththeincreaseofEMtimeundercurrentdensityof1.78×10~4A/cm~2at100℃,andthegrowthofanodicIMCpresentedaparabolicrelationshipwithtimewhilethecathodicIMCgotthinnergradually.However,asforagingsamplesat100℃withoutcurrentstressing,theCu_6Sn_5IMCpresentedasymmetricalgrowthwithaslowerratethantheanodicIMCofEMsamples.Thetensileresultsindicatedthatthetensilestrengthofthesolderjointsundercurrentstressdeclinedmoredrasticwithtimethantheagingsamples,andthefracturemodetransformedfromductilefracturetobrittlefracturequicklywhilethefracturemodeofagingsamplestransformedfromcup-coneshapedfracturetomicroporousgatheringfractureinaslowway.