简介:ThedosimetricphosphorsLi_3PO_4:M(M=Tb,Cu)wereproducedbymodifiedsolid-statemethod.ThestructuralandmorphologicalcharacterizationwascarriedoutthroughX-raydiffraction(XRD)andscanningelectronmicroscope(SEM).Additionally,thephotoluminescence(PL),thermoluminescence(TL)andopticallystimulatedluminescence(OSL)propertiesofpowderLi_3PO_4dopedwithTbandCuwerestudied.ItisadvocatedthatLi_3PO_4:CuphosphornotonlyshowshigherOSLsensitivity(25timesormore)butalsogivesfasterdecayinOSLsignalsthanthatofLi_3PO_4:Tb~(3+)phosphor.Theminimumdetectabledose(MDD)ofLi_3PO_4:M(M=Tb,Cu)phosphorsisfoundtobe21.69×10~(-3)and3.33×10~(-6)J·kg~(-1),respectively.InOSLmode,phosphorshowslineardoseresponseintherangeof0.02-20.00J·kg~(-1).InTLmode,sensitivityofLi_3PO_4:CuphosphorismorethanthatofLi_3PO_4:Tbphosphor.Thekineticsparameterssuchasactivationenergyandfrequencyfactorsweredeterminedbypeakshapemethod,andphotoionizationcrosssectionsofpreparedphosphorwerecalculated.
简介:55%SiCp/A356(体积部分)以铜锌金焊接在把Zn-Al合金用作filler金属的空中的composites被调查。在以铜锌金焊接的过程期间,超声的颤动为结合被用于样品,进在基础材料的矩阵合金的filler金属的重要溶解发生了。当以铜锌金焊接的温度被增加,在基础材料的部分融化层的厚度增加了。原文如此,在基础材料的部分融化层的粒子在超声的行动下面被变成液体filler,有同类地分布式的加强的一张契约在团结以后被获得。体积部分原文如此,在契约的粒子能被改变以铜锌金焊接的温度改变。最大值原文如此,契约材料的粒子体积部分在500的以铜锌金焊接的温度到达了37%?????????????敷摬摥??
简介:FluorescenceandcofluorescencepropertiesofTb(Ⅲ)solidcomplexeswerestudiedusingpyromelliticacid(PMA)asligandandfluorescenceinertionsasdopingelements.Thecofluorescenceenhancement,aresultofligandsensitizedfluorescence,wasobservedinTb(Ⅲ)solidcomplexesdopedwithfluorescentinertionsLa(Ⅲ),Gd(Ⅲ),Ca(Ⅲ),andSr(Ⅲ).Theeffectofthetypeandcontentofdopingelementsonfluorescenceenhancementwasstudied,andoptimumconditionsweredetermined.TheresultsshowthatGd(La,Ca,Sr)hasclearcofluorescenceeffectinsolidcomplexTb-M-PMAsystem,andinpresentwork,rareearthcomplexfluorescentpowderthatemitsbrightgreenfluorescenceatultravioletexcitationwasobtained,whichhadpotentialapplicationasfluorescentanti-counterfeitink.
简介:Basedonclustervariationmethod(CVM)andnaturaliterationmethod(NIM),order-disorderphasetransitionintheintercalationcompoundsM1/2TiS2issimulatedbycomputer.Thefavorableconditions,underwhich3a0×a0superstructureisformed,aregiven,andtheresultsareingoodagreementwiththeexperimentsandtheoreticalcalculations.TherelationshipbetweencriticaltemperatureandM-ion-vacancyinteractionparameterislinear.
简介:InordertoimprovetheelectrochemicalcyclestabilityofLa-Mg-Nisystem(PuNi3-type)hydrogenstoragealloy,NiinthealloyswaspartiallysubstitutedbyM(M=Cu,Al,Mn).AnewLa-Mg-NisystemelectrodealloysLa0.7Mg0.3Ni2.55-xCo0.45Mx(M=Cu,Al,Mn;x=0,0.1)werepreparedbycastingandrapidquenching.Theeffectsofelementsubstitutionandrapidquenchingonthemicrostructuresandelectrochemicalperformancesofthealloyswereinvestigated.TheresultsbyXRD,SEMandTEMshowthatthealloyshaveamultiphasestructure,includingthe(La,Mg)Ni3phase,theLaNi5phaseandtheLaNi2phase.Therapidquenchingandelementsubstitutionhaveanimperceptibleinfluenceonthephasecompositionsofthealloys,butbothchangethephaseabundanceofthealloys.Therapidquenchingsignificantlyimprovesthecompositionhomogeneityofthealloysandmarkedlydecreasesthegrainsizeofthealloys.TheCusubstitutionpromotestheformationofanamorphousphaseintheas-quenchedalloy,andareversalresultbytheAlsubstitution.Theelectrochemicalmeasurementindicatesthattheelementsubstitutiondecreasesthedischargecapacityofthealloys,whereasitobviouslyimprovesthecyclestabilityofthealloys.ThepositiveinfluenceofelementsubstitutiononthecyclelifeofthealloysisinsequenceAl>Cu>Mn,andnegativeinfluenceonthedischargecapacityisinsequenceAl>Mn>Cu.Therapidquenchingsignificantlyenhancesthecyclestabilityofthealloys,butitleadstoadifferentextentdecreaseofthedischargecapacityofthealloys.
简介:本文重点介绍开发高导热高耐热CEM-3覆铜板的技术背景、技术路线和技术成果。
简介:在伊朗核问题恶化,美元持续走弱与全球商品市场特别是基础金属价格全线飘红、屡创新高的形势下,国际黄金价格五月上旬再度强势上扬,现货黄金创730.65美元的新高,虽然在基金的获利回吐盘的打压下,价格在五月末快速回落,但是其长期的上涨趋势仍然保持良好。金价的加速上扬是此轮行情的最显著特征,回顾黄金价格的涨势来看,从国际黄金市场进入牛市以来,价格从低位260美元涨到460美元间隔大约三年半的时间;价格从460美元到660美元只用了6个月的时间,而从660美元到今年的高点730.65美元仅用了一周的时间。从价格的横向比较来看,虽然黄金价格的逊色于原油、铜等品种,但是其波动率还是远远高于道琼斯指数。
简介:材料特别是电子材料对环境的影响越来越受到关注.欧洲和日本率先掀起覆铜板无卤化的进程。目前包括生益科技在内的一些CCL厂正在推出的无卤产品。都有或多或少的缺陷.普遍问题是板材Tg和板材其它性能之间的矛盾。我司目前成功推出无卤高Tg板材(编号:S1165)。该基板具有Tg大于160℃(DSC)、优异的耐热性能(T-300>30min)、低Z轴膨胀系数、低吸水率.具有耐CAF功能.且在后段的PCB加工中.适当调整加工参数.可以获得与FR-4相似的加工性能.因而可应用于未来无铅制程及高精度多层板。板材的最大优点是所需要的固化温度和时间可以明显较其它无卤板得到降低和缩短.提高PCB加工效率。