简介:AWaveguideSwitchDesignUsingElectromagneticBandgapSubstrates;Abradingofbabbittmetalmouldwithhighefficiency;ChillcastingoflocomotivedieselIODIO0cylinderliners;Complexevaluationofmaterialsformetalmolds;CurvedSiliconElectronics;Developmentofcurvedholemachiningwithelectrochemicalmachining(lstreport)-processingmethodbyactuator-lesstool;DevelopmentofCurvedHoleProcessingTechniqueUsingElectrochemicalMachining(2ndReport)-Controllabilityofcurvatureofmachinedcurvedhole-
简介:介绍了刚-挠结合型印制电路板封装技术的原理、做法和在空间技术中应用的重要意义。