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简介:Inordertotransfertheheatfromthearmortothecoolant,tungstenhastobeconnectedwithacopperheatsink.Thejointtechnologyisthemostcriticalissueformanufacturingplasmafacingcomponents.Consequently,thereliabilityofthejointsshouldbeverifiedbyagreatnumberofhigh-heat-flux(HHF)teststosimulatetherealloadconditions.W/CubrazedjointtechnologywithsliverfreefillermetalCuMnNihasbeendevelopedatSouthwesternInstituteofPhysics(SWIP).Screeningandthermalfatiguetestsofonesmall-scaleflattileW/CuCrZrmockupwereperformedona60kWelectron-beamMaterialtestingscenario(EMS-60)constructedrecentlyatSWIP.Themodulesuccessfullysurvivedscreeningtestwiththeabsorbedpowerdensity(Pabs)of2MW/m2to10MW/m2andthefollowing1000cyclesatPabsof7.2MW/m2withouthotspotsandoverheatingzonesduringthewholetestcampaign.MetallurgyandSEMobservationsdidnotfindanycracksatbothsidesandtheinterface,indicatingagoodbondingofWandCuCrZralloy.Inaddition,finiteelementsimulationsbyANSYS12.0underexperimentalloadconditionswereperformedandcomparedwithexperimentalresults.
简介:Inthisstudy,tungsten(W)wascoatedonacopper(Cu)substratebyusingdouble-glowdischargetechniqueusingapureWpanelasthetargetandargon(Ar)asthedischargeandsputteringgas.ThecrystalstructureoftheWcoatingwasexaminedbyX-raydiffraction(XRD).Scanningelectronmicroscopy(SEM)wasperformedwithcross-sectionimagestoinvestigatethepenetrationdepthofWintotheCubody.Additionally,thepropertiesofwearabilityresistance,corrosionresistanceandmechanicalstrengthoftheWcoatedCumatrixwerealsomeasured.Itisconcludedthatindouble-glowplasma,WcoatedCucanbefacilelyprepared.ItisnoticedthatthetreatmenttemperatureheavilydominatesthepropertiesoftheW-Cucomposite.
简介:Chemicalvapordeposition-tungsten(CVD-W)coatingcoveringthesurfaceoftheplasmafacingcomponent(PFC)isaneffectivemethodtoimplementthetungstenmaterialasplasmafacingmaterial(PFM)infusiondevices.ResidualthermalstressinCVD-Wcoatingduetothermalmismatchbetweencoatingandsubstratewassuccessfullysimulatedbyusingafiniteelementmethod(ANSYS10.0code).Thedepositionparametriceffects,i.e.,coatingthicknessanddepositiontemperature,andinterlayerwereinvestigatedtogetadescriptionoftheresidualthermalstressintheCVD-Wcoating-substratesystem.AndtheinfluenceofthesubstratematerialsonthegenerationofresidualthermalstressintheCVD-WcoatingwasanalyzedwithrespecttotheCVD-WcoatingapplicationasPFM.ThisanalysisisbeneficialforthepreparationandapplicationofCVD-Wcoating.
简介:Moleculardynamicssimulationswereperformedtostudytheinteractionbetweenatomichydrogenandsiliconcarbide.Inthepresentstudy,wefocusontheeffectofthesurfacetemperatureonHinteractingwithsiliconcarbide.ThesimulationresultsshowthattheretentionofHatomsinthesampledecreaseslinearlywithincreasingsurfacetemperature.ThedepthprofileanalysisshowsthatthesampleismodifiedbyHbombardment,andthedensityofHatomsisgreaterthanthoseofSiandCatomsneartheinterfaceregionbetweentheH-containingregionandthebulk.However,nearthesurfaceregionthedensitiesofH,SiandCatomsarealmostequivalent.Inthemodifiedlayer,thebondsconsistofSi-CandSi-HandC-H.ThefractionofSi-Cbondsisthegreatest.OnlyafewC-Hbondsarepresent.
简介:Ahighlyreliableinterfaceofself-alignedbarrierCuSiNthinlayerbetweentheCufilmandthenano-porousSiC:H(p-SiC:H)cappingbarrier(k=3.3)hasbeendevelopedinthepresentwork.Withtheintroductionofself-alignedbarrier(SAB)CuSiNbetweenaCufilmandap-SiC:Hcappingbarrier,theinterfacialthermalstabilityandtheadhesionoftheCu/p-SiC:Hfilmareconsiderablyenhanced.AsignificantimprovementofadhesionstrengthandthermalstabilityofCu/p-SiC:H/SiOC:Hfilmstackhasbeenachievedbyoptimizingthepre-cleanstepbeforecap-layerdepositionandbyformingtheCuSiN-likephase.ThiscaplayeronthesurfaceoftheCucanprovideamorecohesiveinterfaceandeffectivelysuppressCuatommigrationaswell.
简介:TheaccumulationofHeonaWsurfaceduringkeV-Heionirradiationhasbeensimulatedusingclusterdynamicsmodeling.Thisisbasedmainlyonratetheoryandimprovedbyinvolvingdifferenttypesofobjects,adoptingup-to-dateparametersandcomplexreactionprocesses,aswellasconsideringthediffusionprocessalongwithdepth.Thesenewfeaturesmakethesimulatedresultscompareverywellwiththeexperimentalones.Theaccumulationanddiffusionprocessesareanalyzed,andthedepthandsizedependenceoftheHeconcentrationscontributedbydifferenttypesofHeclustersisalsodiscussed.TheexplorationofthetrappinganddiffusioneffectsoftheHeatomsishelpfulinunderstandingtheevolutionofthedamagesinthenear-surfaceofplasma-facingmaterialsunderHeionirradiation.
简介:利用角分辨紫外光电子谱对乙烯和乙炔气体在Ru(1010)表面的吸附及与K的共吸附的研究结果表明:当衬底温度超过200K,乙烯即发生脱氢反应,σCH和σCC能级均向高结合能方向移动。在室温下,σCH和σCC能级位置与乙炔在Ru(1010)表面的吸附时的分子能级完全一致。乙烯发生脱氢反应后的主要产物为乙炔。衬底温度从120K到室温,Ru(1010)表面上乙炔的σCH和σCC能级均未发现变化。室温下乙炔仍然可以在Ru(1010)表面以分子状态稳定吸附。在有K的Ru(1010)表面上,室温时σCC谱峰几乎。碱金属K的存在促进了乙炔的分解。
简介:本真空控制保护系统是为北京同步辐射装置(BSRF)上的3W1高功率(总功率为2.54W)扭摆磁铁(Wiggler)光束线(包括前端区、3W1A和3W1B)而设计和建造的。主要建造目的是,保护北京正负电子对撞机(BEPC)电子储存环的超高真空系统和其它光束线不要受到在某一条光束线上突然发生的灾难性真空事故的破坏,以及保护无水冷却和冷却水意外中断了的光束线部件不要被扭摆磁铁发射出来的高功率同步辐射所损坏。此外,在活动水冷挡光罩关闭之前,为了防止快速阀的阀板因过热而被损坏,在快速阀中使用了一种熔点温度为1680℃的钛合金阀板。为了给扭摆磁铁光束线提供一个可靠的真空控制保护系统,系统设计是以F1-60MR型可编程序控制器(PLC)为基础的,PLC负责管理系统的状态监测、真空联锁、控制、自动记录和故障报警等。本文叙述了系统的设计。