简介:1.IntroductionTheEMCdesignforthePrintedCircuitBoardhasbeenapopulartopic.Guidelinesandtipsforhigh-speedPCBdesignscouldbefoundfromnumerousresources.WheninvestigatingEMIissuesassociatedwithcircuitboards,manydetailssuchasclockfrequencies,switchingrates,rise/falltimes,signalharmonics,datatransferrates,impedances,traceloading,andtypesandvaluesofthevariouscircuitcomponents,shouldbetakenintoconsiderations.ThephysicallayoutofthePCboardanditsassociatedmetalliccomponentsareimportantconsiderations.Specialattentionshouldbegiventotheplacementandcharacteristicsofsignalsourcecomponents,vias,
简介:MostofelectronicsengineershaveexperiencedEMIrelatedissues.IthasbeenunderstandableandacceptabletocomplainabouttheEMIwhenwehavetroubledebuggingourcircuitsorequipment.Peopleliketotreatitasablackboxforthisisagoodexcusetostopusfrominvestigatingwhat'sgoingonbehindthephenomenon.However,thefactisthatwiththeadvancesinmodemmicroelectronics,ithasbeengettingmorechallengingthaneverforelectronicsengineerstoeliminateorreducetheEMIcausedbyhigherfrequencyandhigher-degreeintegration.
简介:1.IntroductionAnyoneworkinginasystemselectromagneticcompat-ibilityenvironmentisusuallypainfullyawareofthefactthat,often,theweakestlinkinthesystemisthecabling.Whetherthisisthecableortheconnectorsthemselves,ormorelikelytheinterfacebetweenthecableandtheconnectorswheretheremaybeapoorconnectionofthecablescreen,theabilityofcablingtoleakorabsorbspurioussignalsisacauseofmuchEMCfrustration.ThissectionwilladdressthebasisofthecablingrelatedEMIphenomenonandthebestcablingpractice.
简介:文章简要概述电磁感应电流试验原理及标准对接地开关开合电磁感应电流的特性要求,例举ZFl5—500型GIS的接地开关开合电磁感应电流的试验方法、试验线路、试验参数计算,以及试验结果分析。
简介:摘要:在了解与介绍EMC发射和辐射相关知识的前提下,文章充分考虑空调产品在EMC测试整改过程中的问题,根据其特有性提出空调产品在整改过程中的注意事项与特殊点,并结合实例提出整改方法。
简介:摘要随着通信和电气技术的发展应用,电气与电子设备的干扰和抗干扰问题日益突出,电磁兼容的诊断测试越加显得重要。与传统的EMC测试系统相比,文中设计的测试系统分为2个部分,分别确认干扰源的频率范围和位置所在。能够更加快速、准确地得到干扰源的位置和频带参数,大大提高了解决问题的效率。
简介:摘要电子设备的电磁兼容抗扰度决定了其在电磁环境下工作的稳定性和安全性。在集成技术的快速发展的当今,电子设备越来越趋于集成化、微型化、网络化。因此,其电磁兼容性显得尤为重要。要提高电子设备的电磁兼容抗扰度要从以下两方面着手一是在产品设计开发时就引入电磁兼容概念,从电路的设计到元器件的选择,都将电磁干扰的可能考虑进去,从系统内部来提高整体的抗扰能力;二是在成型设备的干扰关键部位或者外部增加防护措施,以达到理想的电磁兼容效果。