简介:Aconductionchannelmodelispropsedtoexplainthehighconductivitypropertyofnc-Si:H.Detailedenergybanddiagramisdevelopedbasedontheanalysisandcalculation,andtheconductivityofthenc-Si:Hwasthenanalysedonthebasisofenergybandtheory.Itisassumedthattheconductivityofthenc-Si:Hstemsfromtwoparts:theconductanceoftheinterface,wherethetransportmechanismisidentifiedasathermal-assistedtunnelingprocess,andtheconductancealongthechannelaroundthegrain,whichmainlydeterminedthehighconductivityofthenc-Si:H.Theconductivityofnc-Si:Hiscalculatedandcomparedwiththeexperimentdata.Thetheoryisinagreementwiththeexperiment.
简介:Ananalysisisgiventoexplaintheinstabilityofthehighconductivitypropertyofnc-Si:Hfabricated.Detaileddiscussioniscarriedoutconcentratingontheconductivityandgrowthmechanism.Itisassumedthattheinstabilityoftheconductivityofthenc-Si:Hstemsfromtwopart:thephasetransitionfromnanocrystallitesintoa-Si:H,andtheoxygenincorporationofthethinlayerofthefilm,whichcontributesmoretotheeffectwhenthefilmsufferstheexposuretoair.Thetheoryisinagreementwiththeexperimentandmeasurement.
简介:摘要 简要探讨了数控铣加工时常见的虎钳、永磁吸盘、压板、卡盘和组合夹具等装夹方式及特性,并设计了一次装夹加工三面的工装等工艺设计装夹方式,并以电极加工为例阐述了其在数控加工工艺设计时的重要性。