简介：

简介：

简介：Thenormallycenteredelectronbeamandnon-centeredelectronbeamweldingofTiAltoTC4wasinvestigatedinordertoanalyzetheelectronbeamweldabilitybetweenTiAl/TC4dissimilarmaterials.MacroscopiccoldcrackeasilyoccurrednearTiAlsubstrateinthejoints.Theoptimaltensilestrengthwasrelatedtotheweldingheatinput.Theweldstructureswerecomposedofbulkycolumnargrainsandequiaxedgrains.Theisolatedphasesconsistedoflargequantitiesofα2-Ti3Alphase,smallquantityofB2phase,γ-TiAlphaseandYAl2phase.InsufficientmeltingofthebasemetaloccurredintheweldwhenthebeampositionleanedtotheTC4side.Thetensilestrengthcouldbeimprovedwhenthedeflectionwaslimitedintheoptimumrange.Otherwise,non-fusionzonewaseasilygeneratedintheweld,whichledtothelowtensilestrength.

简介：ThesusceptibilityofweldedjointfortheX65pipelinesteeltoH2Sstresscorrosioncracking(SCC)isinvestigated.SCCtestsonthesteelarecarriedoutintheenvironmentbasedonNACETM-01-77solutionwithsaturatedgaseousH2S.Thethresholdstressintensityfactorandcrackpropagationvelocityarecalculatedaccordingtowedge-openingloading(WOL)specimens.Thethree-dimensionalelastic-plasticfiniteelementanalysisofWOLspecimensisperformedbyusingtheFEMprogrammingpackageANSYS.Stressfieldandconcentrationofhydrogendistributionpropertyaheadofthecracktipareobtained.ThispapersurveyedthemicrostructureofweldedjointandstudiedonthemechanicalpropertiesofX65pipelinesteel.Itprovidesexperimentalbasisforstudyingstresscorrosion.Theresultsofnumericalanalysisareconsistentwithconclusionsofstresscorrosiontest.

简介：本文针对N4／1Cr18Ni9Ti与N4／0Cr25Ni20复合板的特殊焊接要求，根据NB／T47014—2011《承压设备焊接工艺评定》的要求，制备2块N4／1Cr18Ni9Ti试板，2块N4I／0Cr25Ni20试板，尺寸均为500mmX150mmX（4＋14）mm。不锈钢基层采用GTAW打底，焊丝选用HOCr21Ni10，SMAW填充与盖面，焊条选用A302与A402。镍复层的焊接采用手工钨极氩弧焊，焊丝选用含Ti、AI等脱氧元素的ERNi-1焊丝，保护气体选择98％Ar＋2％H2。试板焊接完成，外观检验合格后进行100％RT，检测结果符合JB厂r4730，2—2005I级合格，镍复层进行100％PT，检测结果符合JB／T4730．5—2005I级。两种焊接试板分别取样并做拉伸、弯曲力学性能分析，镍复层焊缝做化学成分分析。通过两块焊接试板试验对比，不锈钢基层焊接材料选择HOCr21Ni10焊丝与A302焊条。镍复层焊接采用ERNi-1焊丝，焊接保护气体为98％Ar＋2％H2。通过焊接工艺评定试验研究，解决了N4／1Cr18Ni9Ti与N4I／0Cr25Ni20复合板焊接问题，提高了用户坩埚的返修质量与再次使用寿命，为使用单位节约了成本。

简介：Dynamicsinpartialtransientliquidphasebonding(PTLPbonding)ofSi3N4ceramicwithTi/Cu/Timulti-interlayerwassystematicallystudiedthroughmicro-analysisofjointinterfaces.Theresultsshowthatgrowthofreactionlayerandisothermalsolidificationprocessiondoatthesametime.GrowthofreactionlayerandmovingofisothermalsolidificationinterfaceobeytheparaboliclawgovernedbythediffusionofparticipatingelementsduringthePTLPbonding.Coordinationoftheabovetwodynamicsprocessisdonethroughtimeandtemperature.Whenreactionlayerthicknessissuitableandisothermalsolidificationprocessisfinished,thehighbondingstrengthatroomtemperatureandhightemperatureareobtained.

简介：ＴｈｅｒｍａｌｂｅｈａｖｉｏｒｏｆＢ４Ｃｐａｒｔｉｃｌｅｓｕｎｄｅｒｐｌａｓｍａａｒｃｐｏｗｄｅｒｓｕｒｆａｃｉｎｇｃｏｎｄｉｔｉｏｎ￥ＷＡＮＧＸｉｂａｏ；ＺＨＡＮＧＷｅｎｙｕｅ；ＬＵＴｏｎｇｌｉａｎｄＰＥＮＧＪｉｅ(ＨｅｂｅｉＵｎｉｖｅｒｓｉｔｙ...

简介：

简介：