简介：Fatiguecrackingtestsofasolderjointwerecarriedoutusingin-situscanningelectronmicroscopy(SEM)technologyundertensileandbendingcyclicloadings.Themethodforpredictingthefatiguelifeisprovidedbasedonthefatiguecrackgrowthrateofthesolderjoint.Theresultsshowthattheeffectoftheloadingtypeonthefatiguecrackgrowthbehaviorofasolderjointcannotbeignored.Inaddition,thefiniteelementanalysisresultshelpquantitativelyestimatetheresponserelationshipbetweensolderjointstructures.Thefatiguecrackinitiationlifeofasolderjointisingoodagreementwiththefatiguelife(N50%)ofatotallyelectronicboardwith36solderjoints.

简介：Thedeformationmeasurementofelectrosynthesizedpolythiophene(Pth)thinfilmsisdifficultbecauseofthesmallthicknessandhighflexibilityofthespecimen.Anelectronicspecklepatterninterferom-etry(ESPI)methodisusedtomeasurethedeformationofPthfilmsofthicknessesintherangeof4-65μmTheirstress-straincurvesareobtained.ItisfoundthatthemechanicalpropertiesofPthfilmsaresensitivetothespecimenthickness.Thetensilestrengthincreaseswithdecreasingthicknessofthinfilmfrom10μm.TheinfluenceoftheelectrochemicalsynthesisconditionsonthemechanicalpropertiesofPthfilmsisalsodis-cussed.