简介:ThefatiguepropertyofAZ31magnesiumalloyanditsTIGweldedjointswereinvestigated.Theultrasonicpeeningtreatment(UPT)wasusedtoimprovethefatiguepropertyoftheTIGweldedjoints,whichwastreatedattheweldtoebytheUPTprocess.ThetestresultsshowthatthefatiguestrengthofthebasemetalofAZ31magnesiumalloysis57.8MPa,andthoseofthefilletjointandthetransversecrossjointarerespectively20.0MPaand17.2MPaat2×106cycles.ThefatiguestrengthsoftwokindsofweldedjointstreatedbytheUPTarerespectively30.3MPaand24.7MPa,whichhavebeenimprovedby51.5%and43.6%,respectively.Thefatiguelifeofthefilletjointspecimensisprolongedbyabout2.74timesandthefatiguelifeofthetransversecrossjointspecimensisprolongedbyabout1.05timeswhenthestressrangeisat40.0MPa.
简介:Manyapplicationsofultrasonic-assistedmethodswereusedduringmetalsolidification,buttheycouldnotbeintroducedintoweldpool.Inthispaper,awayofultrasonicassistedTIGweldingisintroduced.Bydirectlyimposedultrasonicvibrationonweldingarc,thevibrationinteractswitharcplasmaandpassestotheweldpool.Measurementresultsshowthatarcpressureissignificantlyincreasedwiththeultrasonicvibrationandthearcpressuredistributionmodelsarechanged.Bead-on-plateweldingtestsonSUS304confirmthatthistechnologycaninfluencethestyleofmetalmeltingandincreaseweldpenetrationdepth.
简介:Studyoncontactlessultrasonicsensorandseamtracking¥HouWenkao;HuShengsunandZhaoJiaruiTianjinUniversityZhangShaobin(QingHuaUnive...
简介:AnanalysistechniquecombiningRBSwithPIXEtechnologybyx-particlesincidentbeamwasconstructedandappliedtoanalyselightimpuritiesinheaviersubstrates.ItcanruninmeasuringRutherfordbackscatteringandX-rayspectrainrandomandchannelingmode,simultaneously.Beingusedtoanalysesulphuratomsim-plantedintoGaAssinglecrystals,thismethodisrelativelysimpleandquick-operating.Itisespeciallyusefulforanalysinglightimpuritiesinsemiconductorcompounds,optoelectronicandmicrowavematerials.
简介:ProblemsaboutsurfacemountingprocessforfinepitchdevicesandreasonsonsolderbridgingofLtypeleaddevicesweldedaredepicted.Bridgingmechanismandinfluencefactorsareanalyzedwithtwo-dimensionalgeometricmodel.Basedonthis,high-densitysurfacemounttechnology(SMT)forfinepitchLtypeleaddevicesheatedbyscan-ninglaserisraised.SurfacemountprocessforQFP208onprintedcircuitboard(PCB)isstudied.Theresultsoftestsarethatitisquitepossibletosolvethesolderbridgingofsurfacemountingforpitchdeviceswithscanninglaser-heat-ingmethod.
简介:55%SiCp/A356(体积部分)以铜锌金焊接在把Zn-Al合金用作filler金属的空中的composites被调查。在以铜锌金焊接的过程期间,超声的颤动为结合被用于样品,进在基础材料的矩阵合金的filler金属的重要溶解发生了。当以铜锌金焊接的温度被增加,在基础材料的部分融化层的厚度增加了。原文如此,在基础材料的部分融化层的粒子在超声的行动下面被变成液体filler,有同类地分布式的加强的一张契约在团结以后被获得。体积部分原文如此,在契约的粒子能被改变以铜锌金焊接的温度改变。最大值原文如此,契约材料的粒子体积部分在500的以铜锌金焊接的温度到达了37%?????????????敷摬摥??
简介:Ultra-finetitaniumcarbonitride(TiCN)matrixmaterialswithagrainsizelessthan1μmweresuccessfullypreparedbyvacuummicrowavesintering.ThemillingprocessforrawTiCNparticlesandthemicrostructureandpropertiesofcermetsproducedwithacompositionof15wt.%WC-17wt.%(Co+Ni)-9wt.%Mo2C-59wt.%Ti0.7N0.3andsinteredbyvacuummicrowavewereanalyzedbyscanningelectronmicroscopy(SEM)andX-raydiffraction(XRD).Theresultsshowthataball-to-powdermassratioof8:1andamillingtimeof50hprovidedappropriateconditionsfortheproductionofultra-fineTiCNsolidsolutionpowders.Theuseofvacuummicrowavesinteringproducedcermetswithmuchfinergrainandblackcorestructuresandhigherrelativedensityandhardnessthanthoseproducedbyvacuumsinteringtechnology.
简介:Inthisessay,westudiedhowheatinputaffectedthemicrostructure,hardness,grainsizeandheat-affectedzone(HAZ)dimensionofWCX355ultra-finegrainsteelwhichwasweldedrespectivelybytheultranarrow-gapwelding(UNGW)processandtheoverlayingprocesswithCO2asprotectiveatmosphereandlaserweldingprocess.Theexperimentalresultsshowwhentheheatinputchangedfrom1.65kJ/cmto5.93kJ/cm,thewidthofitsHAZrangedfrom0.6mmto2.1mm.Theaveragegrainsizegrewupfrom2~5μmofbasemetalto20~70μmandfoundnoobvioussoftenphenomenoninoverheatedzone.Thewidthofnormalizedzonewasgenerallywideas2/3asthatofthewholeHAZ,andthegrainsizeinthiszoneissmallerthanthatinbasemetal.Underthecircumstanceofequalheatinput,theHAZwidthofUNGWisnarrowerthanthatofthelaserwelding.